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Machine length: 2,615 mm
... , high-volume
wafer processing.
- Ideal for: wafer-level processing (WLP)
- Applications: wafer cleaning, photoresist descum/stripping, surface preparation, dielectric
... small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... serve series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... small series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... also series production. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
... production / automation. Low pressure plasma treatment is a proven technique for controlled ultra-fine cleaning, adhesion enhancement (activation and etching) and coating of thin films on substrate surfaces. Plasma ...
Diener electronic GmbH & Co. KG
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