Plasma surface treatment machine MARCH SPHERE™

for platesautomaticfor wafers

Overview
The MARCH SPHERE™ Series is a family of plasma surface treatment systems engineered for uniformity, repeatability and high throughput in wafer-level packaging (WLP) and panel-level packaging (PLP) processes. Based on a patented three-axis symmetrical plasma chamber and advanced process control, SPHERE systems deliver consistent surface activation, contamination removal and process stability to improve yield and downstream adhesion performance.

MARCH ExoSPHERE
ExoSPHERE is optimized for panel-level processing and large-area substrates. Its symmetrical chamber architecture provides even plasma activation and cleaning across wide surfaces, reducing voids in underfill and improving adhesive results. The platform accepts multiple product formats and integrates into automated lines or standalone production. SMARTTune™ plasma management enables rapid setup and stable operation to minimize downtime.

• Ideal for: panel-level processing (PLP)
• Applications: underfill preparation, surface activation, contamination removal
• Formats supported: panels, carriers, strips, JEDEC/Auer® boats and similar fixtures

MARCH StratoSPHERE
StratoSPHERE is tailored for wafer-level production and supports wafers up to 300 mm. The chamber symmetry and plasma confinement deliver high uniformity and repeatability across wafers. The system features modular configurations, advanced wafer handling and fast changeover capabilities for efficient, high-volume wafer processing.

• Ideal for: wafer-level processing (WLP)
• Applications: wafer cleaning, photoresist descum/stripping, surface preparation, dielectric patterning
• Supported wafer size: up to 300 mm (12 inches)

Key capabilities and benefits

• Patented three-axis symmetrical plasma chamber for uniform treatment and repeatability
• High process control and SMARTTune™ plasma management for rapid setup and stable operation
• Modular, production-ready automation and flexible integration into automated lines
• Short cycle times and high throughput to improve yield and reduce variability
• Broad substrate compatibility: panels, wafers, carriers, strips, JEDEC/Auer® boats
• Applications include surface activation, adhesion improvement, contamination removal, underfill prep, photoresist descum/stripping and dielectric patterning

Technical specifications

• Series: MARCH SPHERE™ Series
• Chamber architecture: patented three-axis symmetrical plasma chamber
• Process control: SMARTTune™ plasma management
• Supported formats: panels, wafers, carriers, strips, JEDEC/Auer® boats
• Wafer support: up to 300 mm (12 inches) (StratoSPHERE)
• Configurations: modular and scalable for wafer-level (StratoSPHERE) and panel-level (ExoSPHERE) production
• Primary applications: surface activation, contamination removal, adhesion improvement, underfill preparation, photoresist descum/stripping, dielectric patterning