Adhesive dispensing station Vantage® XL

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Overview
The ASYMTEK Vantage® Series is a precision fluid dispensing platform engineered for advanced semiconductor packaging at wafer, substrate and panel levels. The platform combines high-speed jetting, automated calibration and closed-loop controls to deliver repeatable dispensing for miniaturized components and high-throughput production.

Features and benefits

• Dispense into die-to-die gaps < 200 μm and avoid keep-out zones < 250 μm
• High throughput: single IntelliJet up to 49,000 DPH; dual IntelliJet up to 90,000 DPH
• Automated calibration and patented real-time dispense correction for consistent wet dispensing
• Confocal and non-contact laser height sensing for reflective and transparent substrates
• Closed-loop controls, post-dispense inspection and full traceability for process stability
• Industry 4.0-ready connectivity via ASYMTEK NE Connect API and Canvas® SDK

Vantage (standard)
Flexible precision dispensing platform optimized for wafer- and substrate-level packaging where accuracy, process flexibility and throughput are required.

Vantage features

• Supports 200 mm and 300 mm wafers and 310 × 310 mm panels
• Single IntelliJet throughput up to 49,000 DPH; dual IntelliJet up to 90,000 DPH
• Graphical Canvas® programming for quick setup and simulation

Vantage XL
Configured for large-format panel-level packaging where panel size, thermal management and flatness are critical to yield.

Vantage XL features

• Process panels up to 510 × 515 mm (additional sizes with custom tooling)
• Integrated thermal management to minimize warpage and optimize underfill flow
• High-speed dual-valve IntelliJet jetting with real-time correction for improved accuracy

Software — Canvas®
Canvas® provides graphical programming, guided wizards, quick-reference data tiles and offline programming to reduce production downtime.

• Scan and simulate dispensing on a virtual canvas
• Guided setup wizards and offline programming
• Quick access to sensors, process controls and historical data

Supported valves and dispensing technologies

• IntelliJet® jetting systems, NexJet NJ-8
• DispenseJet DJ series (DJ-2100, DJ-2200, DJ-9500)
• DV-series valves (DV-01, DV-05A, DV-07, DV-09) and Heli-Flow pumps (DV-7000, DV-8000C)

Process options and integrations

• Calibrated Process Jetting (CPJ)
• Continuous path motion control and Fids-on-the-Fly automated fiducial recognition
• High-resolution vision packages and non-contact height sensing

Applications

• Wafer-level and substrate-level dispensing
• Panel-level packaging and large-format advanced packaging
• Underfill, bonding, sealing and adhesive dispensing for semiconductor packaging

Compliance / patents
Patented and patent-pending real-time dispense correction technologies (example US patents: 9,707,584; 10,150,131; 10,737,286).

Technical specifications

• Series name: ASYMTEK Vantage® Series
• Minimum die-to-die gap handling: < 200 μm
• Keep-out avoidance: < 250 μm
• Single IntelliJet throughput: up to 49,000 DPH
• Dual IntelliJet throughput: up to 90,000 DPH
• Panel support (Vantage): 310 × 310 mm; (Vantage XL): up to 510 × 515 mm
• Height sensing: confocal and non-contact laser options
• Software: Canvas® (graphical programming, offline, wizards)
• Process controls: closed-loop control, post-dispense inspection, full traceability