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COM-HPC computer-on-module COM-HPC-cRLS
13th Generation Intel® Core™USB 2.0USB 3.0

COM-HPC computer-on-module - COM-HPC-cRLS - ADLINK TECHNOLOGY - 13th Generation Intel® Core™ / USB 2.0 / USB 3.0
COM-HPC computer-on-module - COM-HPC-cRLS - ADLINK TECHNOLOGY - 13th Generation Intel® Core™ / USB 2.0 / USB 3.0
COM-HPC computer-on-module - COM-HPC-cRLS - ADLINK TECHNOLOGY - 13th Generation Intel® Core™ / USB 2.0 / USB 3.0 - image - 2
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Characteristics

Form factor
COM-HPC
Processor
13th Generation Intel® Core™
Ports
USB 2.0, USB 3.0, SATA, Mini PCIe, SO-DIMM
Applications
industrial, medical

Description

ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments. The module provides support for up to128GB DDR5 memory with up to 3200 MT/s combined with increased cache, two 2.5GbE LAN, and AI inferencing capabilities, making it ideal for on-edge AI use cases. Equipped with Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the COM-HPC-cRLS ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT applications, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more. Specifications: 13th Gen Intel® Core™ desktop processor Up to 24 cores (8 P-cores and 16 E-cores), 32 threads Intel® AVX-512 VNNI, Intel® DL Boost Intel® UHD 770 Xe graphics Up to 128GB DDR5 SO-DIMM at 3200 MT/s 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes 2x 2.5GbE, Intel® TCC, TSN capable 4x USB 3.0/2.0/1.1, 8x USB 2.0 2x SATA, 2x UART, 12x GPIO

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