Overview Advanced Energy's Trek e‑chuck (electrostatic chuck) supplies deliver precise control of clamp voltage, offset voltage and DC bias offset, together with configurable thresholds for over‑current, wafer‑present and wafer‑clamped. Custom clamp/de‑clamp sequences and programmable wave shapes optimize chuck behavior to reduce sticky wafer and wafer‑popping, improving throughput and yield in semiconductor manufacturing.
Product status Active
Key features - Monitored thresholds: over‑current, wafer‑present and wafer‑clamped
- Adjustable clamp voltage and offset voltage
- Internal or external DC bias offset control
- Customizable clamp/de‑clamp sequences and programmable wave shapes
- Designed to prevent sticky wafer and wafer‑popping
- Improves throughput, reduces wafer damage and increases yield
Technical documentation (selected) - Trek 645 Data Sheet — Data Sheet — PDF — 111 KB — February 6, 2024
- Trek 645‑HT Data Sheet — Data Sheet — PDF — 163 KB — December 11, 2025
- Trek 646 Data Sheet — Data Sheet — PDF — 116 KB — February 18, 2024
- Electrostatic Semiconductor Wafer Clamping/Chucking System (ESC) Application Note — Application Note — PDF — 607 KB — June 15, 2023
Applications For semiconductor manufacturing processes that require reliable electrostatic chuck power control, including deposition, etch, implant and electron‑beam inspection applications.
Technical specifications - Control parameters: over‑current, wafer‑present, wafer‑clamped thresholds
- Voltage controls: adjustable clamp and offset voltages
- Bias control: internal or external DC bias offset control
- Sequence control: configurable clamp/de‑clamp sequences and programmable wave shapes
- Primary benefits: reduces wafer damage, prevents sticking and popping, improves yield and throughput
- Referenced models: Trek 645, Trek 645‑HT, Trek 646