Integrated circuit socket

BGASMT

Advanced's patented Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or different footprint. Customized Adapter and Interposer solutions from Advanced Interconnections eliminate costly board redesign when projects change. We go beyond just package conversion, adapting to your changing requirements from concept to prototype to production. Typical Applications and Unique Features Transparent interface from a new BGA or LGA device to existing QFP pads. Proprietary solder sphere connection offers a robust, process compatible, and cost effective replacement for fragile QFP leads. 0.50mm to 1.27mm pitch. Solutions to obsolescence for most SMT or thru-hole lead styles. Sourcing and device attach for passive and active components. Stand-offs, solder preforms, SMT designs, and more.