{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Medium Size Socket for Power IC Through hole type Dual Style 2.54mm / 0.100" Pitch ●How to order ex: PDSP-CM1-Dxx-GG x: Number of positions 04,12,20 (Even Number) *Regarding to other ...
High Current Dvice Socket High Temperature ℃ 5.45mm Pitch Right Angle Low Outgassing This is a socket that can correspond to PC Board arrangement with height restrictions by turning the device ...
High Current Dvice Socket High Temperature TO-247 4Pin Right Angle Low Outgassing This is a socket that can correspond to PC Board arrangement with height restrictions by turning the device sideways. ● ...
Advanced's patented Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP ...
IC Socket, Carrier, Precision IC-Socket 2,54 mm Mating pin size (range) - ø 0,40-0,56 ☐ 0,25x0,45 Pincount - 4, 6, 8, 10 ... 48 Gender - Female Material contact ...
Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness Active alignment for IC package positioning Cantilever ...
Yamaichi Electronics
Clamshell THT socket solution for different BGA and LGA packages from 0.65mm up to 1.00mm pitch Available in 3 pitch sizes and various depopulation versions V-shape contact structure prevents any damage of coplanarity ...
Yamaichi Electronics
Clamshell CMT solution Suitable for BGA and LGA packages with 0.40 mm pitch U-shape or double bow contact structure Compact solution suitable in manual applications Suitable for different kind of depopulation Stamped contact type Mating ...
Yamaichi Electronics
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages IC package dimensions from 2 x 2 to 10 x 10 sqmm Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular ability ...
Yamaichi Electronics
Open top THT socket solution suitable for BGA packages with 0.80 mm pitch Self-contacting structure without upper pressing force (ZIF) Tweezer contacting structure to nip the sides of solder balls to prevent damages ...
Yamaichi Electronics
IC Sockets / IC Headers, 2.54mm Pitch - Standard Version, 4.2mm Profile Case/Cover/Actuator Thermoplastic, rated UL94 V-0 Contact Material Sleeve: screw machined brass Clip: 4-Finger-Clip, ...
W+P PRODUCTS
IC Sockets / IC Headers 1.78mm Pitch - Shrink DIP Case/Cover/Actuator Thermoplastic, rated UL94 V-0 Contact Material Sleeve: screw machined brass Clip: 4-Finger-Clip, Beryllium-Copper Contact ...
W+P PRODUCTS
Please specify:
Help us improve:
remaining