- Electricity - Electronics >
- Electronic Component >
- BGA socket
BGA sockets
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
For BGA(FPGA), LGA Test & Burn-In Socket Pitch 22x22contact max - Can also be used as Burn-in Socket - High reliability - Cost competitive - Short delivery time - Temperature ...
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion ...
Advanced Interconnections
Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch
Advanced Interconnections
... package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or ...
Advanced Interconnections
Clamshell THT socket solution for different BGA and LGA packages from 0.65mm up to 1.00mm pitch Available in 3 pitch sizes and various depopulation versions V-shape contact structure prevents any damage ...
Yamaichi Electronics
Clamshell CMT solution Suitable for BGA and LGA packages with 0.40 mm pitch U-shape or double bow contact structure Compact solution suitable in manual applications Suitable for different kind of depopulation Stamped ...
Yamaichi Electronics
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages IC package dimensions from 2 x 2 to 10 x 10 sqmm Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular ability ...
Yamaichi Electronics
Open top THT sockets for BGA packages with 1.27 mm pitch Secure package alignment due to self-contacting structure without upper pressing force (ZIF) Tweezer contacting structure to nip the sides of ...
Yamaichi Electronics
Open top THT socket solution suitable for BGA packages with 0.80 mm pitch Self-contacting structure without upper pressing force (ZIF) Tweezer contacting structure to nip the sides of solder balls to ...
Yamaichi Electronics
Open top CMT solution suitable for BGA and LGA packages 0.40 mm pitch U-shape or double bow contact structure Open top solution suitable for applications with autoloading equipment Suitable for different kind of ...
Yamaichi Electronics
Your suggestions for improvement:
Receive updates on this section every two weeks.
Please refer to our Privacy Policy for details on how DirectIndustry processes your personal data.
- Brand list
- Manufacturer account
- Buyer account
- Our services
- Newsletter subscription
- About VirtualExpo Group
Please specify:
Help us improve:
remaining