For BGA(FPGA), LGA
Test & Burn-In Socket
Pitch
22x22contact max
- Can also be used as Burn-in Socket
- High reliability
- Cost competitive
- Short delivery time
- Temperature Range(typical):C(typ.)
[Acceptable device]
169-Pin UBGA(Intel)
CS144/CSG144(Xilinx)
256-Pin UBGA(Intel)
CS324/CSG324(Xilinx)
CS280/CSG280(Xilinx)
SF363/SFG363(Xilinx)
484-Pin UBGA(Intel)
CS484/CSG484(Xilinx)
Acceptable device - BGA(FPGA), LGA ,etc
22x22 contact max
Pitch -
Temperature Range(typical) -
For LGA, we manufacture sockets with custom designs to accept your device.
We accept IC device foot pattern and thickness other than on this.