Test & Burn-In Socket
Size
Can also be used as Burn in Socket
●Highly reliable M-pin Probes as contact parts
●High Frequency
For BGA Device, QFN Device
0.4mm/0.016" Pitch : 16x16 Contact Max
0.5mm/0.020" Pitch : 10x10 Contact Max
Current Rate -
Contact Resistance -
Dielectric Strength Voltage -
Insulation Resistance -
Operating Temperature - -
Pitch -
Acceptable Device -
Acceptable Device Size -
We accept IC device foot pattern and thickness other than these.