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... C-Series H-Pin® Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board. Features ...
Smiths Interconnect
D-Series H-Pin® Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series line shares the same configurable features as other socket series in the Smiths Interconnect burn-in ...
Smiths Interconnect
ES family Series of sockets extended the scope of a burn-in socket. The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation to ensure out-of-the-box performance whether liquid or air cooled. Leveraging a variety ...
Smiths Interconnect
ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series ...
Smiths Interconnect
ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The patented H-Pin contact technology in the ESJ Series socket provides versatility and the ability ...
Smiths Interconnect
The K-Series socket is designed to apply flat even pressure on the DUT with a secondary lever once the lid has been closed. This is to ensure that the platen does not skid across the top of the device when closing the lid potentially marking the device. ...
Smiths Interconnect
M-Series socket has long been the gold standard for reliability and out-of-the-box performance burn-in sockets. The high-quality components have been refined and enhanced over their lifetime for optimum performance and the highest quality. M-Series being ...
Smiths Interconnect
The Q-Series socket is available for mid to large package sizes. The Q-Series is a fully molded socket body and lid designed to meet the rigors of a wide variety of accelerated life testing applications. The lid can be configured with or without a heatsink ...
Smiths Interconnect
The R-Series product line is an open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market, there is no need to purchase ...
Smiths Interconnect
Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small outline with very low inductance. The new Open Top QFN ...
Smiths Interconnect
... Test Socket For Crystal Device (Quartz Oscillators, MEMS, etc.) Open Top Type This test socket is designed for automated device setup and is ideal for performance evaluation of components such as crystal oscillators. - Compatible with various package ...
JC CHERRY INC.
... TO Package Test Socket For TO-252/D-PAK Size12x24.9mm/0.47x0.98" Clamshell - Burn-in Test - Kelvin Contact(Option) - Cost competitive - Operating Temperature : [Acceptable Device] NTD5862N(ON Semiconductor) RD3U080AAFRA(ROHM) IXTY14N60X2(IXYS) PG-TO252-3-11(Infineon) SUD50N06-09L(Vishay) GK,DK,SK ...
JC CHERRY INC.
... TO Package Test Socket For TO-263/D2-PAK Size16x27.9mm/0.63x1.10" Clamshell - Burn-in Test - Kelvin Contact(Option) - Cost competitive - Operating Temperature : [Acceptable Device] IRF5305STRLPBF(Infineon) VS-10TTS08S-M3 (Vishay) FDB28N30 ...
JC CHERRY INC.
... TO Package Test Socket For TO-263/D2-PAK Size18x32.9mm / 0.71x1.30" Clamshell - Burn-in Test - Kelvin Contact(Option) - Current Rating : 10A - Operating Temperature : [Acceptable Device] FDB28N30 (ON Semiconductor) IRFS7437PbF (Infineon) STB11NK50ZT4 ...
JC CHERRY INC.
... TO Package Test Socket For TO-263-7/D2-PAK Size18x32.9mm / 0.71x1.30" Clamshell - Burn-in Test - Kelvin Contact(Option) - Current Rating : 12A - Operating Temperature : [Acceptable Device] AUIRFSA8409-7P (Infineon) C3M0075120J (CREE) STH300NH02L-6 ...
JC CHERRY INC.
... TO Package Test Socket For TO-252/D-PAK Size18x32.9mm / 0.71x1.30" Clamshell - Burn-in Test - Kelvin Contact(Option) - Current Rating : 10A - Operating Temperature : [Acceptable Device] IRF40R207 (Infineon) TK560P65Y (TOSHIBA) MJD47 (ON ...
JC CHERRY INC.
... For TOLL(TO-Leadless) Package Test Socket Clamshell Type It can be used for testing space-saving and high-power surface-mounted devices, TOLL (leadless). You can choose from with or without flange. - Kelvin Contact (option) - For Burn-in Test - ...
JC CHERRY INC.
... TO Package Test Socket For TOLT(TO-Leaded top-side cooling) Package Size19.5x32.4mm Here is a socket that can be used for testing thin, high-current, and heat-dissipating surface mount devices with the TOLT package (PG-HDSOP-16). - Kelvin Contact ...
JC CHERRY INC.
... TO Package Test Socket TOLG(TO-Leaded with Gullwing) Size 16x27.7mm This is a socket compatible with TOLL and features gull-wing leads. It is a surface-mount device with robust implementation strength, suitable for testing TOLG packages (PG-HSOG-8). - ...
JC CHERRY INC.
... Test Socket for R2PAK Package - Test sockets that maximize SiC/GaN MOSFET performance - Compatible with THB and HTRB reliability tests - In-house high-performance contacts ensure stability under harsh conditions - Kelvin connection (Optional) enables ...
JC CHERRY INC.
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