Transistor outline (TO) package test socket GD18-TO263-K-S1045X103

burn-inKelvin

TO Package Test Socket For TO-263/D2-PAK Size18x32.9mm / 0.71x1.30" Clamshell - Burn-in Test - Kelvin Contact(Option) - Current Rating : 10A - Operating Temperature : [Acceptable Device] FDB28N30 (ON Semiconductor) IRFS7437PbF (Infineon) STB11NK50ZT4 (STMicroelectronics) C3D06060G (CREE) SK107114 (Sanken) DMTH4004SCTB (Diodes Incorporated) IXTA1R6N50D2 (IXYS) ** Including terminal temperature rise. Also possible to support other terminal patterns. After conducting a simulation, we will decide which dimension to adopt and make a proposal. Through holes KG,DK,SK are for Kelvin contact.If Kelvin Contact is not required, these holes are not necessary. Able to support other device size. Please contact us for more information. Although the device is listed, but it may not be compatible due to the large tolerance of the device dimension. Therfore, please send the sample of the device in advance and we will check the compatibility.