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Transistor outline (TO) package test socket GU16-TO263-K-S1045X103burn-inKelvin
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Characteristics
- Options
- burn-in, Kelvin, for transistor outline (TO) package
Description
TO Package Test Socket
For TO-263/D2-PAK
Size16x27.9mm/0.63x1.10"
Clamshell
- Burn-in Test
- Kelvin Contact(Option)
- Cost competitive
- Operating Temperature :
[Acceptable Device]
IRF5305STRLPBF(Infineon)
VS-10TTS08S-M3 (Vishay)
FDB28N30 (ON Semiconductor)
SK107114 (Sanken)
C3D06060G (CREE)
GK,DK,SK Through holes are for Kelvincontact.
These holes are not necessary ifKelvin Contact is not required.
Generally, TO-263/D2-PAK package size is specified.
However, the size depends on the semiconductor manufacturers and devices.
If you send us your device in advance,we can properly confirm its adoption.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.