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Transistor outline (TO) package test socket GU16-TO263-K-S1045X103
burn-inKelvin

Transistor outline (TO) package test socket - GU16-TO263-K-S1045X103 - JC CHERRY INC. - burn-in / Kelvin
Transistor outline (TO) package test socket - GU16-TO263-K-S1045X103 - JC CHERRY INC. - burn-in / Kelvin
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Characteristics

Applications
for transistor outline (TO) package
Options
burn-in, Kelvin

Description

TO Package Test Socket For TO-263/D2-PAK Size16x27.9mm/0.63x1.10" Clamshell - Burn-in Test - Kelvin Contact(Option) - Cost competitive - Operating Temperature : [Acceptable Device] IRF5305STRLPBF(Infineon) VS-10TTS08S-M3 (Vishay) FDB28N30 (ON Semiconductor) SK107114 (Sanken) C3D06060G (CREE) GK,DK,SK Through holes are for Kelvincontact. These holes are not necessary ifKelvin Contact is not required. Generally, TO-263/D2-PAK package size is specified. However, the size depends on the semiconductor manufacturers and devices. If you send us your device in advance,we can properly confirm its adoption.

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