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Transistor outline (TO) package test socket GD26-QDPAK-x-S151X155
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Characteristics
- Applications
- for transistor outline (TO) package
Description
Test Socket for QDPAK Package
- Test sockets that maximize SiC/GaN MOSFET performance
- Compatible with THB and HTRB reliability tests
- In-house high-performance contacts ensure stability under harsh conditions
- Kelvin connection (Optional) enables fast switching and precise evaluation
Contact Resistance : 50mΩ max
Current Rating : 12A at 25°C(Between Drain and Source)
Withstanding Voltage :DC2000V 1min at 25°C
Insulation Resistance : 500MΩmin at DC500V
Operating Temperature :-40 to +200°C( Including temperature rise due to electrical current)
Compatible with : AIMCQ120R020M1T, AIMDQ75R016M1H, etc.
Catalogs
GD26-QDPAK-x-S151X155
3 Pages
Other JC CHERRY INC. products
Surface-Mount Power Device Test Sockets: for the SiC/GaN Era
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.