- Electricity - Electronics >
- Electronic Component >
- IC device test socket
IC device test sockets
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
... solutions for Package-on-Package (PoP) testing. Complex in its design, PoP test requires simultaneous engagement of both the top and bottom of the IC. The Euclid solution for manual test utilizes a top ...
Smiths Interconnect
Smiths Interconnect's Celsius contact takes advantage of a slightly longer signal path to offer significant advantages in compliance, temperature handling, and current carrying capacity. A self-contained contact, Celsius uses an elastomer only for compliance ...
Smiths Interconnect
... Silmat® Elastomeric Test Socket is a patented, low profile contact engineered specifically to provide electrical and mechanical advantages in the Digital High Speed and PoP Top segments of the Semiconductor Test ...
Smiths Interconnect
... precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads ...
Smiths Interconnect
... oxides on device pad -Short signal path -Tri-Temp socket design to support -55 °C to +150 °C -Configurable design flexibility for integrating into existing hardware setups -Designed for manual test, ...
Smiths Interconnect
... Low Inductance • Optimized design based on test application • Tri-Temp socket design to support -55 °C to +160 °C • Designed for manual test, bench test, and HVM production test ...
Smiths Interconnect
... Low Inductance • Optimized design based on test application • Tri-Temp socket design to support -55 °C to +160 °C • Designed for manual test, bench test, and HVM production test ...
Smiths Interconnect
... mm test height Impedance tuned to match system Consistent stable contact resistance 55 mΩ (Avg.) Hi-coplanarity accommodation Tri-temp socket design to support -55 °C to +150 °C Designed for manual test, ...
Smiths Interconnect
Smiths Interconnect
... consistency, rapid turnaround, and optimized socket performance tailored to your device structure, test environment, and evaluation conditions. Whether you require a prototype IC socket, ...
Seiken Co., Ltd.
... Seiken HC-C (High-Current) IC Socket — Precision, Power, and Performance Engineered for high-current and high-power device testing, Seiken’s HC-C IC Socket is designed ...
Seiken Co., Ltd.
... others. IC sockets are vital to ensuring the quality of these packaged devices through electrical testing, securely holding the chip in place with accurate probe pins. The Structure ...
Seiken Co., Ltd.
... specialized test conditions such as Hall sensors, magnetic-sensitive ICs, and fine-pitch power devices. Customizable Design for Advanced Testing Seiken’s custom IC socket ...
Seiken Co., Ltd.
... Seiken Kelvin IC Sockets — Precision Four-Terminal (Kelvin) Measurement Solutions Seiken’s Kelvin IC Sockets are engineered for high-accuracy, low-resistance measurements using the four-terminal ...
Seiken Co., Ltd.
... HU3PAK Scokets + Evaluation Test Board Set Save time by eliminating the need to design and source sockets and PCBs separately—quickly set up your evaluation environment. - Accelerates development and reduces delays ...
JC CHERRY INC.
... The test socket that enables high-speed transmission signal measurement by adopting the contact method that directly presses the device lead against the board. The "Latch Lock type" that fixes the ...
JC CHERRY INC.
... B1506A Power Device Analyzer Capable of measuring the IV characteristics and CV characteristics of power devices - Design and manufacture of test sockets, printed circuit ...
JC CHERRY INC.
... TO-263-7/D2-PAK Scokets+Evaluation Test Board Set Save time by eliminating the need to design and source sockets and PCBs separately—quickly set up your evaluation environment. - Accelerates development and reduces ...
JC CHERRY INC.
... used for a variety of IC devices and even irregular pin locations. Features: - For Device Evaluation - Usable For Various Device Types - Small Size - Good High Frequency Response - ...
JC CHERRY INC.
... Test & Burn-In Socket Size Can also be used as Burn in Socket ●Highly reliable M-pin Probes as contact parts ●High Frequency For BGA Device, QFN Device 0.4mm/0.016" ...
JC CHERRY INC.
... Supports thermal management, ESD, and emission analysis Custom housing options available for boards without socket holes Ideal for device replacement, software development, and evaluation ...
JC CHERRY INC.
... Test Socket GU29 Frame / QFN pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ●High reliability ●Cost competitive ●Temperature: For QFN Device How ...
JC CHERRY INC.
... Non-Floating base test sockets are common for testing QFN and other leadless devices. They are a two-piece design that holds spring pins or elastomeric contact sets between a socket ...
the best suppliers
Subscribe to our newsletter
Receive updates on this section every two weeks.
Please refer to our Privacy Policy for details on how DirectIndustry processes your personal data.
- Brand list
- Manufacturer account
- Buyer account
- Our services
- Newsletter subscription
- About VirtualExpo Group