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... solutions for Package-on-Package (PoP) testing. Complex in its design, PoP test requires simultaneous engagement of both the top and bottom of the IC. The Euclid solution for manual test utilizes a top ...
Smiths Interconnect
Smiths Interconnect's Celsius contact takes advantage of a slightly longer signal path to offer significant advantages in compliance, temperature handling, and current carrying capacity. A self-contained contact, Celsius uses an elastomer only for compliance ...
Smiths Interconnect
... Silmat® Elastomeric Test Socket is a patented, low profile contact engineered specifically to provide electrical and mechanical advantages in the Digital High Speed and PoP Top segments of the Semiconductor Test ...
Smiths Interconnect
... precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads ...
Smiths Interconnect
... oxides on device pad -Short signal path -Tri-Temp socket design to support -55 °C to +150 °C -Configurable design flexibility for integrating into existing hardware setups -Designed for manual test, ...
Smiths Interconnect
... Low Inductance • Optimized design based on test application • Tri-Temp socket design to support -55 °C to +160 °C • Designed for manual test, bench test, and HVM production test ...
Smiths Interconnect
... Low Inductance • Optimized design based on test application • Tri-Temp socket design to support -55 °C to +160 °C • Designed for manual test, bench test, and HVM production test ...
Smiths Interconnect
... mm test height Impedance tuned to match system Consistent stable contact resistance 55 mΩ (Avg.) Hi-coplanarity accommodation Tri-temp socket design to support -55 °C to +150 °C Designed for manual test, ...
Smiths Interconnect
