PoP test socket Euclid

high-frequencymanual

Overview
Precision top-and-bottom array socket designed for simultaneous Package-on-Package (PoP) testing. Suitable for lab, engineering, SLT and ATE environments, the socket supports high-speed signal testing with a controlled-impedance PCB loop-back to preserve signal integrity.

Series
Euclid Series

Design & Operation
Smiths Interconnect's Euclid solution for manual test uses a top contactor assembly mounted to the handler. The top assembly includes a PCB presenting peripheral targets. The bottom contactor employs a spring probe architecture that transfers signals from the tester interface PCB to the top PCB, routing signals to the memory attachment features on the package top. The design validation process addresses alignment under varying thermal, stress and tolerance conditions. Euclid manual test products may include a manual compression lid assembly that, in many designs, carries the memory device.

Features & Benefits

• Innovative design with a wide range of material options
• Proprietary engineered plastic body for larger BGA/LGA test
• Precision alignment calculation
• Replaceable floating or fixed device alignment guide
• Z-axis tolerance stacking analysis
• FEA analysis
• Customization and design flexibility for specific applications

Technical specifications

• Simultaneous top and bottom array engagement for Package-on-Package (PoP) testing
• Top contactor assembly includes a PCB presenting peripheral targets
• Bottom contactor: spring probe architecture to transfer signals from tester interface PCB to top PCB
• Controlled-impedance loop-back with PCB for high-speed signal integrity
• Manual compression lid option for top contactor; lid can carry memory device in many designs
• Design verification tools to validate alignment under thermal, stress and tolerance variances
• Customization available for lab, engineering, SLT and ATE applications