Burn-in test socket R-Series H-Pin®

The R-Series product line is an open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market, there is no need to purchase new burn-in boards. The open-top design allows for autoloading, and un-loading of the integrated circuit. The small socket footprint outline allows you to utilize the full resources available in the burn-In system for each burn-in board. Features & Benefits - Industry-proven design, In-house tooling, molding and machining with 100% automated assembly. - Extensive catalog of components, configurable options - H-Pin offers unmatched DC performance Feature Options - Auto IC loading / un-loading compatible - High temperature materials for above 200 °C applications - Drop-in replacement for legacy products Series Info RE - 5 mm to 9 mm package size range for QFN, LGA, and BGA R - 10 mm to 14 mm package size range for QFN and LGA - 10 mm to 13 mm package size range for BGA - Drop in replacement for legacy designs RL - 16 mm to 19 mm package size range for QFN, LGA, and BGA