IC device test socket

high-frequency

Seiken Fine-Pitch IC Sockets — Precision Solutions for Ultra-Fine Pitch Device Testing As semiconductor devices continue to shrink and integration density increases, the need for high-precision fine-pitch testing solutions has become critical. Seiken’s Fine-Pitch IC Sockets are specifically engineered to address these challenges—enabling accurate, stable, and repeatable testing for today’s most compact and complex semiconductor devices. Built on Seiken’s proprietary tubeless probe technology, these sockets support pitch sizes as fine as 130 μm, providing reliable contact and exceptional mechanical strength in even the most demanding wafer-level and package-level testing environments. Whether for prototype evaluation, mass production testing, or R&D applications, Seiken’s fine-pitch sockets deliver precision and durability engineers can trust. High-Precision Fine-Pitch Testing At the core of Seiken’s fine-pitch technology lies an innovative tubeless probe structure, eliminating traditional guide tubes to achieve higher density and reduced crosstalk between contacts. This advanced structure ensures consistent contact pressure, low contact resistance, and outstanding reliability, even during repeated high-frequency and high-current testing. Key Benefits: •Ultra-fine pitch support: Handles pitches as small as 130 μm, suitable for next-generation semiconductor devices. •Exceptional accuracy and stability: Ensures reliable signal integrity in micro-pitch and high-speed test environments. •Compact, durable construction: Maintains mechanical rigidity for long-term, high-cycle operation. •Supports non-magnetic and mechanical customization: Ideal for specialized test conditions such as Hall sensors, magnetic-sensitive ICs, and fine-pitch power devices. Customizable Design for Advanced Testing Seiken’s custom IC socket design service ensures complete compatibility with your device geometry, test requirements, and environmental conditions. Our in-house engineering and manufacturing teams provide end-to-end support—from concept design to precision machining and assembly—ensuring fast turnaround and consistent performance. Production flexibility allows orders starting from just one unit, making these sockets ideal for prototype development, engineering validation, and low-volume production runs. Technical Specifications / Features •Supported Pitch: As fine as 130 μm •Customizable Design: Non-magnetic and other requirements. •Flexible Production: From single-unit prototypes to low-volume manufacturing •Reliable Contact: High mechanical strength and consistent contact force •Ideal For: Fine-pitch chips, discrete components, WL-CSP, QFN, SON, and other advanced semiconductor devices