High-frequency test socket

QFPBGA

After semiconductor chips are diced from the wafer, they are packaged into various formats such as BGA, QFP, and others. IC sockets are vital to ensuring the quality of these packaged devices through electrical testing, securely holding the chip in place with accurate probe pins. The Structure of IC Sockets At Seiken, we offer expertly designed IC sockets that are tailored to the specific requirements of your package. From layout to selecting the best contact probes, we customize every aspect based on your device’s shape, size, electrode design, materials, and surface treatments. Choose from a range of socket types to best suit your application: - Latch Type: A standard design perfect for multiple device testing, providing even pressure distribution with a convenient lid mechanism. - Clamshell Type: A hinged design that opens and closes easily, minimizing effort during repeated testing cycles. - Bottle Cap Type: Features an adjustable dial screw for fine control over contact pressure—ideal for high-pin-count devices that require strong contact force. Key Features & Advantages - Full customization available: Seiken offers fully customized IC test sockets to meet your unique requirements. Whether it’s adjusting dimensions, lid styles, or probe technologies—including non-magnetic, high-frequency, high-current among other specifications—we create tailored solutions that perfectly match your needs. - One-stop fixture design and production: Seiken provides an integrated service from design to manufacturing, including small-lot production starting from just one unit. Whether you require a single socket or a complete board with resin processing, socket assembly, and wiring design, we deliver solutions tailored to your testing environment. - Optimized Layouts for a wide range of IC packages: Our expert team will propose the best socket layout for your IC packages, streamlining your current testing processes while supporting future product innovations. IC Socket Integration for Reliable Testing Testing IC packages traditionally involves time-consuming package replacements through multiple reflow cycles. With Seiken’s IC test sockets, you can easily swap packages without the hassle, improving testing efficiency. Backed by extensive experience and cutting-edge technology, Seiken delivers optimal IC socket solutions that ensure precision, reliability, and ease of use. Application Examples - Packaged Chips - New Device Prototypes - Diced Chips - BGA, QFP - Modules, and More Characteristics / Technical Specifications - Customizable for various package types (BGA, QFP, etc.) - Multiple socket types: Latch, Clamshell, Bottle Cap - Adjustable contact pressure for high-pin-count devices - Support for non-magnetic, high-frequency, high-current probe technologies - Integrated design and manufacturing, including small-lot production - Optimized layouts for diverse IC packages