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IC device test socket GD21-HU3PAK-K-TEKBfor transistor outline (TO) packageKelvin
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Characteristics
- Applications
- for IC devices, for transistor outline (TO) package
- Options
- Kelvin
Description
HU3PAK Scokets + Evaluation Test Board Set
Save time by eliminating the need to design and source sockets and PCBs separately—quickly set up your evaluation environment.
- Accelerates development and reduces delays in prototyping
- Supports Kelvin connection for precise measurements
- Custom design and production available upon request
PC Board size : 70mm x 70mm
PC Board thickness : 1.6mm
Current Rating : 12A at 25°C(Between Drain and Source)
Insulation Resistance : 500MΩ min.
Dielectric withstanding voltage : AC2000Vrms 1 minute at 25°C(Between Drain and Source)
Temperature Range : -55 to +175°C
Catalogs
GD21-HU3PAK-K-TEKB
1 Pages
Other JC CHERRY INC. products
Socket + Burn-In Test Board Set
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.