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Electrolytic tinning
coppernickelfor aeronautics

electrolytic tinning
electrolytic tinning
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Characteristics

Type
electrolytic
Substrate
copper, nickel
Applications
for aeronautics
Certifications
ISO 9001

Description

Tin Plating Tin is a silver-colored, ductile metal whose major purpose is to promote solderability to otherwise unsolderable base metals. Tin has generally good depositing characteristics over a wide range of part geometry. Main Application / Advantages The tin-plating process is applied extensively to protect both ferrous and non-ferrous substrates. Tin being non-toxic, ductile and corrosion resistant is frequently used for the food processing industry. The excellent ductility of tin allows a tin-coated base metal sheet to be formed into a variety of shapes without damage to the surface tin layer. It provides sacrificial protection for copper, nickel and other non-ferrous metals, but not for steel. Tin protects the base metal from oxidation and preserves its solderability, properties ideal for the electronics industry.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.