Surface grinding machine IVG series

automatichigh-precisionautomated loading/unloading

The full automatic grinding machine is a high-precision grinding machine equipped with fully automatic loading and unloading system, uses wafer manipulator to pick up the wafers, has automatic centering, cleaning and drying functions. It can realize automatic grinding process from cassette to cassette, and keep wafers dry in and out. Complete function Automatic thickness measurement and compensation, multistage grinding program, waiting under overloading and other function, meeting various process requirements. Abundant Specification Single or double axis grinding unit. Fully automatic system Fully automatic loading and unloading, automatic grinding system to keep wafers dry in and out Good compatibility Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials.