Reflow soldering oven V8L

vacuumfor PCBfor mass production

1. Significantly reduce solder bubbles in the solder, resulting in a void rate as low as 1-2%. 2. Improve the electrical performance of the product and the welding joints to effectively improve the reliability of the solder joints and the quality of the solder joints. 3. It can be used for PCB double-sided welding, suitable for mass production, and can be continuously put into production line. The average production tact is controlled at 30-60S. 4. The degree of vacuum, vacuum holding time, deflation time, vacuum rate, etc. can be set freely. 5. It is possible to complete the board soldering with the aluminum heat sink installed. 6. Ultra-low power consumption and high heat insulation design based on the concept of environmental protection. The case temperature does not exceed 40 degrees. Model V8L Heating zone 8 Vacuum zone 1 (optional) Cooling zone 2 Heating temperature 280-320℃ (350℃ optional) Vacuum degree 0.5-5Kpa Nitrogen consumption 300-500L/min Oxygen analyzer 1 standard configuration Highest component height 30mm PCB width 100-250mm (optional above 250mm) PCB length 100-350mm Track height 850-950mm Hot air speed adjustment Infinite frequency conversion adjustment Power supply 380V/220V