- Metrology - Laboratory
- Metrology and Test Equipment
- Accelerated aging test system
- Cosmic Equipment S.p.A.
Aging test system Hatina WLBIthermalperformanceaccelerated aging
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Characteristics
- Test type
- aging, thermal, performance, accelerated aging
- Domain
- laboratory, for the electronics industry, for research and development
- Applications
- for semiconductors, for GaN FET
- Configuration
- compact
- Other characteristics
- precision, multichannel, high-voltage
Description
Product overview
The Hatina WLBI is a wafer-level Burn-In (WLBI) and HTOL solution engineered for power devices on wafers. The compact test chamber (nominal footprint 560×560×550 mm; spec sheet D×W×H 560×560×560 mm) connects to standard wafer probers to enable full-wafer burn-in with high parallel throughput. Heaters are embedded at each DUT to provide precise, low-power local thermal control (ovenless approach), reducing energy use and footprint while simplifying automation integration.
Key benefits
Features / Functional capabilities
Parameter / variant notes
Technical specifications
The Hatina WLBI is a wafer-level Burn-In (WLBI) and HTOL solution engineered for power devices on wafers. The compact test chamber (nominal footprint 560×560×550 mm; spec sheet D×W×H 560×560×560 mm) connects to standard wafer probers to enable full-wafer burn-in with high parallel throughput. Heaters are embedded at each DUT to provide precise, low-power local thermal control (ovenless approach), reducing energy use and footprint while simplifying automation integration.
Key benefits
- Supports power technologies: Si, SiC and GaN
- Compatible with 6-, 8- and 12-inch wafers
- Enables full-wafer burn-in and accelerated reliability tests
- High parallel throughput for cost-effective lifecycle testing
- Integrates with standard wafer prober platforms
Features / Functional capabilities
- Compact wafer-level Burn-In chamber designed to interface with standard wafer probers
- High parallel throughput: up to 1,600 test sites concurrently
- Per-site electrical limits: up to 1.2 kV and 2 mA
- Supports functional burn-in, HTGB and HTRB test setups
- Embedded distributed heaters at each DUT for precise, low-power thermal control (ovenless)
- Cleanroom-compatible design and automation-ready integration
Parameter / variant notes
- Func_Test: Yes
- HTGB: Yes
- HTRB: Yes
- BVDSs: possible (future uIDE software revision)
- IDSx: possible (future uIDE software revision)
- Vth: possible (future uIDE software revision)
- Up to 1600 die testing in a single wafer touchdown (3 end-points per site)
Technical specifications
- Number of test sites: Up to 1600
- Dimensions (D × W × H): 560 mm × 560 mm × 560 mm (spec sheet); compact chamber overview: 560×560×550 mm
- Drain High Voltage Power Supply: -50 V to 1.2 kV
- Gate Voltage Power Supply: -50 V to +50 V
- Current during Functional test: 2 mA
- Current during HTRB test: 2 mA
- Current during HTGB test: 2 mA
- Supported test types: functional burn-in, HTGB, HTRB, WLBI (full-wafer)
- Wafer compatibility: 6-, 8- and 12-inch wafers
Exhibitions
Meet this supplier at the following exhibition(s):
Other Cosmic Equipment S.p.A. products
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