Impedance tester M2 Turret Edition

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Overview
Next-generation tester platform for wide bandgap power products. Designed for high-throughput production with rotary turret and conveyor handlers, it measures static parameters, dynamic switching performance, thermal die-attach quality, gate oxide metrics and performs stress tests including avalanche and short-circuit using modular high-performance test generators.

Key benefits

• Maximum throughput: UPH up to 15,000+ devices per hour (index-parallel turret testing).
• Broad device support: SiC, GaN and Si power devices including MOSFETs, IGBTs, JFETs, bipolar devices and diodes.
• Production-ready: Interfaces to rotary and conveyor handlers with modular, expandable architecture for evolving test requirements.

Product presentation / capabilities
M2 Turret Edition integrates ultra-fast test generators and optimized software to split test plans across multiple generators for highest speed. The system is engineered for 24/7 operation in high-volume production with modular options to add AC dynamic switch modules (Quasar, Pulsar), DC parametric modules and QA/thermal modules as needed.

FEATURES / CONFIGURATIONS (summary)
Variants: Turret | Turret Pro | Turret Pulsar | Turret Pulsar Pro
Number of test sites: 4 — HVLV 3kV 200A, RG, Quasar AC test, QA station | 6 — HVLV 3kV 200A, RG, Quasar AC test, FB, UIS, QA station | 4 — HVLV 3kV 200A, RG, Pulsar AC test, QA station | 6 — HVLV 3kV 200A, RG, Pulsar AC test, FB, UIS, QA station
AC dynamic switch performance: M2 DS5 Quasar up to 2kA short circuit | M2 DS5 Quasar up to 2kA short circuit | M2 DS6 Pulsar up to 7.5kA short circuit | M2 DS6 Pulsar up to 7.5kA short circuit
DC parametric test: 3kV 200A (integrated) | 3kV 200A (integrated) | 3kV 600A (integrated) — Expandable to 1,000A | 3kV 600A (integrated) — Expandable to 1,000A

Application areas
High-throughput electrical testing across production stages: KGD, packaged discretes and modules; suitable for wafer probe, discrete strip test and final test stages in power device manufacturing.

Technical specifications

• Platform: M2 modular and expandable tester optimized for ultra-fast electrical test.
• Throughput: UPH up to 15,000+ devices per hour (index-parallel approach).
• Supported technologies: SiC, GaN, Si power devices.
• Test types: Static parametrics, DC parametric tests, AC dynamic switching, thermal die-attach (deltaVSD), gate resistance & capacitance, avalanche and short-circuit stress tests, UIS/body-diode testing.
• DC parametric capability: integrated up to 3 kV; standard 200 A on some variants; Pulsar variants 3 kV 600 A integrated, expandable to 1,000 A.
• AC dynamic switch: Quasar (DS5) up to 2 kA; Pulsar (DS6) up to 7.5 kA short circuit capability.
• Thermal die-attach test: M1 FB deltaVSD 1 kW, up to 300 V / 100 A (available on Pro / Pulsar Pro).
• UIS avalanche: 2.3 kV, 200 A unclamped inductive load (Pro / Pulsar Pro variants).
• Concurrent sites: 4 to 6 depending on variant; configurable RG, Quasar/Pulsar AC tests, FB, UIS and QA stations.
• Integration: Designed for 24/7 operation, rugged and accurate; interfaces with rotary turret and conveyor handlers.