UV laser marking machine LSU3EI

UV laser marking machine
UV laser marking machine
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Characteristics

Technique
UV laser
X travel

Min.: 70 mm (3 in)

Max.: 110 mm (4 in)

Y travel

Min.: 70 mm (3 in)

Max.: 110 mm (4 in)

Description

UV Laser Marking Machine With small UV focus spot and heat affected zone, UV laser marking machine has high absorptivity to 355nm UV-light, which is suitable for many materials.  ● High-performance ultraviolet laser and superior laser beam quality bring exquisite marking effect for customers; ● The rotary table shortens unit processing time. Customer benefits grow exponentially at the same time; ● Equipped with safety hood, it avoids physical injury of operators by misoperation and minimizes the safety risk; ● Small size and good cooling performance. It’s widely used in special materials marking, cutting and processing, such as all kinds of glass, LCD panel, textiles, chip ceramics, semiconductor wafers, IC grains, sapphires, polymer films, etc.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.