Laser perforating machine

Laser perforating machine - Farley Laserlab
Laser perforating machine - Farley Laserlab
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Characteristics

Type
laser

Description

Overview
Infrared picosecond and short-pulse green nanosecond laser perforators are designed for laser perforation of hard, brittle materials such as glass and quartz. Compared with mechanical processing, the system supports continuous 24/7 operation, high processing yield and reliable micro-perforation suitable for photovoltaic cell and module production lines.

Features
  • Imported picosecond and short-pulse green lasers with high beam quality and small focal spot for precise micro-perforation
  • Optional multi-vibration lens system to reduce laser processing time and increase throughput
  • High-speed optical path using imported oscillators and mirrors to ensure high-quality transmission and long-term stability
  • Quartz base with high-precision linear motors and machine vision positioning system for repeatable accuracy and productivity
  • Specially designed automatic loading and unloading system to support continuous production and reduce manual handling


Technical parameters (table)
Laser system - Power: >40W
Laser system - Pulse width: <10ns
Laser system - Laser source: Imported nanosecond green light
Main configuration - Cutting head: Three head
Main configuration - Fθ lens BOX range: 50 mm x 50 mm
Equipment performance - Processing size range: 1000 x 500 mm to 2200 x 1200 mm
Equipment performance - Processing hole position accuracy: ±0.2 mm
Equipment performance - Typical processing time (per hole): <7 s
Operational environment - Power supply: 220 V / 50 Hz
Operational environment - Ambient temperature and humidity: 10–30 °C; humidity <50%
Operational environment - Size (L×W×H): 3700 mm × 2500 mm × 2000 mm
Operational environment - Weight: 4200 kg

Technical specifications
  • Laser type: Imported picosecond / short pulse width (infrared) and imported nanosecond green light source
  • Laser power: >40 W
  • Pulse width: <10 ns
  • Cutting head configuration: Three-head
  • Fθ lens working area: 50 mm × 50 mm
  • Processing size range: 1000 × 500 mm to 2200 × 1200 mm
  • Processing hole position accuracy: ±0.2 mm
  • Typical processing time (per hole): <7 s
  • Positioning and motion: Quartz base with high-precision linear motors and vision positioning system
  • Automatic handling: Specially designed automatic loading and unloading system
  • Power supply: 220 V / 50 Hz
  • Environmental requirements: Temperature 10–30 °C; Humidity <50%
  • Machine footprint (L×W×H): 3700 mm × 2500 mm × 2000 mm
  • Weight: 4200 kg

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Photovoltaic Laser Processing Machines

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