Bluetooth wireless module HY0021
compactlow-power autonomousPCB

Bluetooth wireless module - HY0021 - FDK - compact / low-power autonomous / PCB
Bluetooth wireless module - HY0021 - FDK - compact / low-power autonomous / PCB
Bluetooth wireless module - HY0021 - FDK - compact / low-power autonomous / PCB - image - 2
Bluetooth wireless module - HY0021 - FDK - compact / low-power autonomous / PCB - image - 3
Bluetooth wireless module - HY0021 - FDK - compact / low-power autonomous / PCB - image - 4
Bluetooth wireless module - HY0021 - FDK - compact / low-power autonomous / PCB - image - 5
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Characteristics

Options
Bluetooth, compact, low-power autonomous, PCB, embedded

Description

Features
  • Ultra-small module with slot antenna integrated in a shielded package
  • Minimal PCB footprint—one of the smallest board-level occupied areas
  • Flexible PCB layout support for simplified integration
  • Multiple regional certifications obtained


Product profile
  • Bluetooth version: v5.4 LE 2M PHY
  • Built-in Bluetooth IC: Nordic nRF52805
  • CPU: Arm® Cortex®-M4
  • Memory: 192 KB Flash / 24 KB RAM
  • Integrated clocks: 32 MHz and 32.768 kHz


Applications
  • Wearables
  • Health care devices
  • Remote controls
  • IoT sensors and nodes
  • Beacons
  • Computer peripherals


Evaluation boards
Evaluation boards for development and performance verification are available under model name HY0023; they support characteristic checks and software development.

Documents
Product brief, datasheet, application notes and EVB manual are available for HY0021.

Specifications
  • Bluetooth version: v5.4
  • Bluetooth IC: Nordic nRF52805
  • CPU: Arm Cortex-M4
  • Memory: 192 KB Flash / 24 KB RAM
  • TX output power: +4 to -20 dBm (4 dB steps)
  • Receiver sensitivity: -94 dBm (1 Mbps)
  • TX current: 7.0 mA (DC/DC, +4 dBm)
  • RX current: 4.6 mA (DC/DC, 1 Mbps)
  • GPIOs: 8 (SPI, I2C, UART, QDEC, ADC)
  • ADC: 12-bit, 200 ksps (2 channels)
  • High-speed clock: 32 MHz (built-in)
  • Low-speed clock: 32.768 kHz (built-in)
  • Operating temperature: -40 to +85 °C
  • Operating voltage: 1.7 to 3.6 V
  • Dimensions: 3.5 × 10 × 1 mm
  • Package: 24-pin LGA
  • Certifications: Japan (MIC); U.S.A. (FCC); Canada (ISED); ETSI EN 300 328 V2.2.2; Bluetooth SIG

Exhibitions

Meet this supplier at the following exhibition(s):

ELECTRONICA 2026
ELECTRONICA 2026

10-13 Nov 2026 Munich (Germany) Hall Hall B5 - Stand B5.360

  • More information
    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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