Low-power autonomous wireless module HY0025

PCBBluetoothcompact

Overview
Model Name: HY0025 (Under development). Ultra-small Bluetooth Low Energy module with a slot antenna integrated into a shielded package; optimized to minimize board-level occupied area and to allow flexible PCB patterning.

Features

• Ultra-small module with slot antenna built into shielded package
• Minimal board-level occupied area
• Flexible PCB patterning to simplify board design
• Various regulatory certifications obtained or planned
• Channel Sounding for high-accuracy distance measurement

Product Profile

• Bluetooth v6.0 — LE 2M, LE Coded, Channel Sounding
• SoC: Nordic nRF54L15
• CPU: Arm® Cortex®-M33, 128 MHz
• Memory: 1.5 MB NVM / 256 KB RAM
• Integrated 32 MHz and 32.768 kHz crystal oscillators
• Integrated DC-DC and LC components

Applications

• Wearables
• Health care devices
• Remote controls
• IoT endpoints
• Beacons
• Computer peripherals

Specifications
Bluetooth version: v6.0
Built-in Bluetooth IC: Nordic nRF54L15
CPU: Arm Cortex-M33, 128 MHz
Memory: 1.5 MB NVM / 256 KB RAM
TX power: +8 dBm
RX sensitivity: -96 dBm (1 Mbps)
TX current (DC-DC): 9.8 mA (1 Mbps, +8 dBm)
RX current (DC-DC): 3.4 mA (1 Mbps)
Multi-protocol: 802.15.4, Thread®, Zigbee®, Matter™
GPIO: 15 GPIO + nRESET
Interfaces / Peripherals: NFC, SPI, I2C, I2S, UART, PDM, QDEC, PWM, 14-bit ADC
High frequency clock: Built-in 32 MHz crystal
Low frequency clock: Built-in 32.768 kHz crystal
LC components for DC-DC: Built-in
Operating temperature range: -40°C to +105°C
Operating voltage range: 1.7 V to 3.6 V
Dimension: 3.5 x 10.0 x 1.3 mm
Package: 29-Pin LGA
Certification/Qualification: Japan (MIC); U.S.A. (FCC) (Planned); Canada (ISED) (Planned); ETSI EN300 328 V2.2.2 (Planned); Bluetooth (Planned)

Technical specifications

• Model: HY0025
• Bluetooth: v6.0 (LE 2M, LE Coded, Channel Sounding)
• SoC: Nordic nRF54L15
• CPU: Arm Cortex-M33, 128 MHz
• Memory: 1.5 MB NVM / 256 KB RAM
• Clocks: Built-in 32 MHz and 32.768 kHz crystals
• Power components: Integrated DC-DC and LC components
• RF performance: TX power +8 dBm; RX sensitivity -96 dBm (1 Mbps)
• Current consumption: TX 9.8 mA (1 Mbps, +8 dBm); RX 3.4 mA (1 Mbps)
• Multi-protocol support: 802.15.4, Thread®, Zigbee®, Matter™
• GPIO / Interfaces: 15 GPIO + nRESET; NFC, SPI, I2C, I2S, UART, PDM, QDEC, PWM, 14-bit ADC
• Operating range: -40°C to +105°C; 1.7 V to 3.6 V
• Mechanical: 3.5 x 10.0 x 1.3 mm; 29-Pin LGA