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- Adhesive application head module
- Focke Meler Gluing Solutions, S.A
Adhesive application head module Pro Series
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Description
Pro Series, the new Meler´s modules
New Logical Simplicity technology
Welcome to the leap towards greater precision in adhesive application
»New components
»Tested against tougher conditions
»Final savings thanks to the improvements implemented
Pro Series improvements
1.- High resistance to premature adhesive leakage
2.-Increased durability against more aggressive adhesives and harsher conditions
3.-More precise dosing due to a more stable and consistent opening-closing response of the new Pro Series.
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Exhibitions
Meet this supplier at the following exhibition(s):
Pack Expo International
18-21 Oct 2026 Chicago (USA - Illinois) Hall North Building - Stand N-6171
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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