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Adhesive application head module Pro Series

adhesive application head module
adhesive application head module
adhesive application head module
adhesive application head module
adhesive application head module
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Description

Pro Series, the new Meler´s modules New Logical Simplicity technology Welcome to the leap towards greater precision in adhesive application »New components »Tested against tougher conditions  »Final savings thanks to the improvements implemented Pro Series improvements 1.- High resistance to premature adhesive leakage 2.-Increased durability against more aggressive adhesives and harsher conditions 3.-More precise dosing due to a more stable and consistent opening-closing response of the new Pro Series.

Exhibitions

Meet this supplier at the following exhibition(s):

Hispack 2024
Hispack 2024

7-10 May 2024 Barcelona (Spain)

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    FACHPACK 2024
    FACHPACK 2024

    24-26 Sep 2024 Nürnberg (Germany)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.