OverviewThe DynamIx FXR family provides stationary and portable digital detector array (DDA) solutions for high-throughput industrial radiography and field inspections. FUJIFILM image-processing technology enables rapid acquisition and high-resolution results for in‑line and site-based nondestructive testing.
DynamIx FXRThe FUJIFILM DynamIx FXR is a stationary DDA designed for integration with X-ray generators and for installation in radiography cabinets or walk-in exposure rooms. It is intended for high-volume, in‑house inspection workflows where fast throughput and immediate digital imaging are required.
Key FXR model- FXR D-1611: 100 μm pixel pitch, energy capability up to 15 MeV, active area 16 in × 16 in to accommodate multiple small to medium parts per exposure.
DynamIx FXR PadThe FUJIFILM DynamIx FXR Pad series are lightweight, portable flat panel detectors for remote or on-site inspections. Often used with gamma or portable X-ray sources, FXR Pad units allow rapid image capture and immediate review on a laptop or tablet, suitable for piping and asset inspection in energy and field-service environments.
Key FXR Pad model- NDT 1417MA: 14 × 17 in wireless amorphous silicon flat panel detector, compact and industrially rugged, high radiation resistance, wired or wireless data/signal communication options.
What is a Digital Detector Array (DDA)?A DDA is a direct digital radiographic system that converts incident X-rays to digital images using an industrial flat panel detector. It provides near‑instant image availability with minimal post‑processing, enabling faster decision making and higher throughput compared with film-based methods.
How DDA compares to other radiography methodsDDA systems deliver immediate imaging without film handling or chemical development. Compared with computed radiography (CR), DDA typically offers faster image availability and can be advantageous for detecting larger defects and supporting high-volume inspection lines.
Industries that benefit from DDA- Oil & gas — piping and asset inspection
- Manufacturing — in‑line and high‑volume inspection
- Automotive — component and assembly inspection
- Aerospace — inspection of castings and critical parts
Which model is best for youChoose a stationary DynamIx FXR for factory high‑throughput inspection and an FXR Pad model for portable field inspections. FUJIFILM offers multiple panel sizes and interface options to match energy levels, part sizes and site conditions.
Technical specifications- FXR D-1611: 100 μm pixel pitch
- FXR D-1611: energy handling up to 15 MeV
- FXR D-1611: active area 16 in × 16 in
- NDT 1417MA: active area 14 in × 17 in; wireless portable amorphous silicon flat panel detector
- NDT 1417MA: compact, industrial ruggedness and high radiation resistance
- NDT 1417MA: wired and wireless data/signal communication
- DDA advantages: real‑time imaging, instant processing, elimination of chemical development, improved throughput and portability of digital images