Storage server TO25-ZM0-AA01

networkcalculationrack-mount

Product overview
The TO25-ZM0-AA01 is an ORV3-compatible 2OU, 2-node compute barebone optimized for rack-scale deployments. It supports dual AMD EPYC™ 9005 processors, a 24-DIMM DDR5 topology and mixed Gen5/Gen3 NVMe front hot-swap storage for high-density, serviceable data center use.

Key Features

• Dual-socket platform compatible with AMD EPYC™ 9005 Series (cTDP up to 400 W in dual configuration)
• 24 DIMM slots (12-channel DDR5 RDIMM per CPU), up to DDR5-6400
• Front hot-swap storage: 8× E3.S Gen5 NVMe (4 per CPU) plus 2× E1.S Gen3 NVMe (shared PCIe Gen3 x4)
• 2× low-profile PCIe Gen5 x16 slots (one per CPU) and 4× OCP NIC 3.0 SFF Gen5 x16 modules (2 per CPU)
• Front/rear Intel® I350-AM2 1 Gb/s LAN ports with cross-node data link and dedicated management LAN
• 48–54 V DC bus-bar power delivery (OCP-style centralized PSU architecture)
• Tool-less front access and serviceable design for efficient maintenance

Block Diagram
Includes system block diagram illustrating motherboard, backplane and I/O board connectivity and placement for the TO25-ZM0-AA01 node, useful for integration and thermal/power planning.

Open Compute Project (OCP) / ORV3
Designed for OCP Open Rack V3 deployments with node-optimized layout, separate PSU shelf and bus-bar power distribution to maximize rack density, thermal efficiency and front serviceability at rack scale.

Specifications

• Form factor: 2OU, 2-node (ORV3 / OCP Open Rack V3)
• Motherboard: MZM3-OP0
• Processors: Dual AMD EPYC™ 9005 Series (SP5), dual-socket up to 400 W cTDP
• Memory: 24 DIMM slots, DDR5 RDIMM, 12-channel per CPU, up to 6400 MT/s
• LAN: Front I/O board: 2× 1 Gb/s (Intel® I350-AM2), 1× management LAN (10/100/1000); Rear: 2× 1 Gb/s (cross-node link)
• Video/BMC: ASPEED® AST2600 integrated, 1× Mini-DP, BMC UART
• Storage: 8× E3.S Gen5 NVMe front hot-swap (4 per CPU); 2× E1.S Gen3 NVMe front hot-swap (PCIe Gen3 x4 shared)
• PCIe expansion: 2× LP PCIe Gen5 x16 (one per CPU); 4× OCP NIC 3.0 SFF Gen5 x16 (2 per CPU); OCP_1 supports NCSI
• Power: 48 V–54 V DC bus bar power
• Operating: 10°C–30°C; humidity 8%–80% non-condensing; non-operating -40°C–60°C
• Packaging: 1170×770×296 mm; contents: 1× TO25-ZM0-AA01 barebone, 2× CPU heatsinks
• Part numbers: Barebone 6NTO25ZM0RR000AA01*; Motherboard 9MZM3OP0UR-000*; Backplane COBP520 9COBP520NR-00*; Backplane COBP880 9COBP880NR-00*; I/O COFP33A 9COFP33ANR-00*; I/O COFP340 9COFP340NR-00*