19" rack DCA3-ST0

modularservercabling

Overview
GIGABYTE OCP Open Rack V3 (ORV3) compliant DLC rack solution for high-density data center deployments. Presented as the ORV3 DLC Rack DCA3-ST0 with integrated manifolds and a 4OU liquid-to-liquid CDU, engineered for optimized thermal management and power efficiency.

Key features

• 44OU ORV3 rack with integrated manifolds
• 4OU liquid-to-liquid CDU
• Cooling capacity up to 200 kW (dependent on approach temperature)

Key advantages

• Efficient rack density: supports mixed node configurations (e.g. 2OU 2-node / 2OU 3-node) for balanced compute density and power
• Thermal optimization: designed for cold-aisle/hot-aisle deployment to reduce cooling energy
• Improved power efficiency: central power shelf concept to lower PUE and simplify power distribution
• Maintainability: front-cold-aisle access, tool-less serviceable elements and fewer PSUs per rack for faster replacements
• Higher MTBF: centralized power architecture and reduced component count to minimize failure points

Optional components / Flexible OCP rack integration

• L-shaped shelves and conversion between 21" and 19" power shelf formats (including 1OU L-shelves)
• Structural add-ons: extension frames, rack doors, dummy covers
• Cable management: cable trays and cable panels
• Power shelf options: 21" 33 kW power shelf with 3 x C13 AC outputs (Delta AC-205A) and 19" 33 kW power shelf without C13 AC outputs (Delta ECD68000075)

Optional / ordering

• Ordering number: 6NDCA3ST0MR00000001*

Technical specifications

• Dimensions (W×H×D, mm): 800 × 2286 × 1200
• Open Rack version: ORV3
• Heat dissipation capacity: 130 kW at approach temperature 5°C; 200 kW at approach temperature 8°C
• CDU power consumption (full load): 1300 W
• Water flow rate: Primary 200 LPM; Secondary 130 LPM
• Operating conditions: ambient 0°C to 50°C; liquid 20°C to 50°C
• Bus bars: 1 × 48 V bus bar
• Available node space: 18OU + 21OU (23rd OU occupied by reinforced bar)
• Part number: 6NDCA3ST0MR00000001*