Grinding spindle DQFX-16506

motorizedwater-cooled

Overview
The DQFX-16506 is a semiconductor grinding spindle with a Φ165 mm spindle body that supports a 200 mm (8 inch) grinding wheel at speeds up to 6,000 rpm. It delivers 8.5 kW continuous (S1), 13.5 N·m continuous torque (S1) and maintains vibration velocity ≤ 0.15 mm/s. Designed with an air bearing and water cooling, driven by a synchronous motor; tool change is manual.

Summary specifications
Diameter: Φ165 mm
Maximum speed: 6,000 rpm
Grinding wheel: 200 mm (8 inch)
Continuous power (S1): 8.5 kW
Continuous torque (S1): 13.5 N·m
Vibration velocity: ≤ 0.15 mm/s
Weight: 79.5 kg

Technical specifications

• Model: DQFX-16506
• Spindle body diameter: Φ165 mm
• Grinding wheel supported: 200 mm (8 inch)
• Maximum rotational speed: 6,000 rpm
• Continuous power (S1): 8.5 kW
• Intermittent power (S6): 12.75 kW
• Continuous torque (S1): 13.5 N·m
• Peak torque (S6-40%): 20.3 N·m
• Motor type: Synchronous
• Bearing: Air bearing
• Maximum electrical frequency: 400 Hz
• Rated voltage: 220 V
• Rated current S1: 27 A
• Rated current S6: 40.5 A
• Air supply: 76–84 L/min @ 0.6 MPa
• Cooling: Water cooling, flow ≥ 2.5 L/min
• Motor temperature sensor: KTY84-130
• Tool change: Manual
• Vibration velocity: ≤ 0.15 mm/s
• Weight: 79.5 kg

Applications

• Precision grinding of semiconductor wafers and disks up to 200 mm.
• Integration in wafer-processing lines, R&D grinding stations and precision grinding machines requiring low vibration and high stability.
• Requires compressed air 76–84 L/min at 0.6 MPa and water cooling flow ≥ 2.5 L/min.