Epoxy adhesive Spabond™ 570
teak decktwo-componentlow-viscosity

epoxy adhesive
epoxy adhesive
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Characteristics

Chemical composition
epoxy
Type of substrate
teak deck
Number of components
two-component
Technical characteristics
low-viscosity
Applications
for bonding
Working temperature

Max.: 30 °C
(86 °F)

Min.: 10 °C
(50 °F)

Description

¬ Simple 1:1 mix ratio by weight and volume ¬ Excellent Health and Safety ¬ High tolerance to off ratio mixing ¬ Excellent application characteristics ¬ Highly sag resistant - to 15mm on a vertical surface ¬ Tolerant of very high humidity INTRODUCTION Spabond 570 teak deck adhesive has been formulated to give the optimum mechanical and working properties for bonding teak decking to a composite hull. Designed specifically for this purpose, it is the ideal adhesive for bonding down teak decks. In use, Spabond 570 has a tolerant 1:1 mix ratio and a thixotropic, gel type consistency. This makes Spabond 570 very easy to measure, mix and apply. Spabond 570 is non-corrosive, solvent free and cures at room temperature. When cured, Spabond 570 is tough, highly adhesive and very strong and generates green strength rapidly (does not require post curing).

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.