Defect inspection machine CR7300 series

DR-SEMfor wafersindustrial

Inline Review SEM which contributes yield enhancement with high speed ADR and accurate ADC • Enhanced SEM image resolution for cutting-edge device development and mass production • New in-situ solution of yield control which is quantified and indicating an Electrical Properties (R / C) in semiconductor process • Enhanced productivity which improved throughput performance by 2x compared to the previous model • Contribute to the N3-Generation device development by advanced defect review and analysis function for unpatterned wafers • Improved defect classification performance and accuracy remarkably by adopting AI based ADC(Automatic Defect Classification)