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Tile grinding polishing machine DWSJ-6020

tile grinding polishing machine
tile grinding polishing machine
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Characteristics

Treated material
tile

Description

Microcrystal Glass Ceramic Tile Grinding Machine Type: DWSJ-6020 Machine parameters Working speed: 1-5m/min Grinding thickness: 2-30mm Max grinding size: 2000*2000 Min grinding size: 20mm*20mm Machine size: 2000*1100*1620 Voltage: 380v Power: 9.55KW Weight: 1200KG Machine introduction Machine characteristics 1. The key parts of the machine adopts cast iron material, and is formed by natural effects processing which has the advantages of smooth, beautiful appearance, deformation and so on. 2. Method of clamping part imported from Italy PUPL synchronization with horizontal transfer, which greatly improve the precision of grinding, grinding parts adopt high-precision grinding head motor. 3. The configuration of the machine is chamfer with two wheels and flat two grinding wheels. It can realized the purpose of chamfer edge polishing and flat,edges and chamfers fine grinding. PRODUCT FEATURE 3D microcrystalline-glass ceramic tile 3D microcrystalline-glass ceramic tile is a composite of ceramic tiles and the microcrystalline-glass which has been printed personalized graphics by 3D high-definition printer in high temperature. And then grind edge and anti-skid to be finised.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.