Sample preparation grinding polishing machine Cyrex
metallographic samplePLC-controlledlapping

Sample preparation grinding polishing machine - Cyrex - IMT CO.,LTD. - metallographic sample / PLC-controlled / lapping
Sample preparation grinding polishing machine - Cyrex - IMT CO.,LTD. - metallographic sample / PLC-controlled / lapping
Sample preparation grinding polishing machine - Cyrex - IMT CO.,LTD. - metallographic sample / PLC-controlled / lapping - image - 2
Sample preparation grinding polishing machine - Cyrex - IMT CO.,LTD. - metallographic sample / PLC-controlled / lapping - image - 3
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Characteristics

Treated material
for sample preparation, metallographic sample
Other characteristics
PLC-controlled
Associated function
lapping, radius grinding, finishing

Description

Overview
One grinding stage and four polishing stages. The grinding stage includes automatic dressing and grinding-amount adjustment as standard. Simultaneous polishing across stages increases throughput. Each stage is fitted with washing and drying functions as standard to prevent carryover of contaminants from previous processes.

Main specifications
  • PLC control with color touch panel for intuitive operation and flexible process setup.
  • Improved productivity thanks to integrated cleaning at each polishing stage; polishing and cleaning performed in one continuous process.
  • Configurable large polishing setup: base configuration includes one grinding stage and four polishing stages; can be expanded to five or more stages. Built-in memory stores up to 28 polishing conditions.
  • Holder capacity up to 14 specimen holders; each holder accepts six φ50 mm specimens (up to 168 specimens depending on size). Supports custom-shaped holders.


Cyrex machine specifications
  • Power supply: 3-phase 200–220 V, 50/60 Hz
  • Compressed air: 0.5–0.7 MPa (with filter and regulator)
  • Water supply: 0.2–0.4 MPa, ≤20 L/min
  • Grinding stone: φ355 mm; rotational speed 800–1700 rpm (adjustable)
  • Polishing table: φ310 mm (compatible up to φ350 mm); rotation speed 60–350 rpm (adjustable by 1 rpm)
  • Specimen holder diameter: φ160–200 mm (supports special shapes); holder rotation speed 60–200 rpm (adjustable by 1 rpm)
  • Applied pressure: 60–600 N (adjustable by 1 N)
  • Polishing condition memory: 28 conditions, PLC control
  • External dimensions / Weight: W6325×D1545×H1900 mm / approx. 5000 kg


Technical specifications
  • Grinding stages: 1 (automatic dressing and grinding amount adjustment standard)
  • Polishing stages: 4 (simultaneous operation; configurable, expandable to 5+)
  • Holder capacity: up to 14 holders (six φ50 mm specimens each; up to 168 specimens)
  • Control: PLC with color touch panel; 28-condition memory
  • Dimensions / weight: W6325×D1545×H1900 mm; approx. 5000 kg

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.