Temperature monitoring system E-LIT

measurementinfrared camerahigh-performance

Electronic / Semiconductor Testing Solution - E-LIT * Thermal analysis of electronic and semiconductor devices * Modular test bench for online lock-in measurement * Reliable detection of thermal anomalies in the mK and μK range * Spatial location of defects in multilayer PCBs and multi-chip modules * Use of thermographic systems with cooled and uncooled detectors * Operational software IRBIS® 3 active with comprehensive analysis options in laboratory conditions E-LIT – Automated testing solution system allows non-contact failure inspection of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure. The power supply for this process is clocked with a synchronisation module and failures that produce mK or even μK differences are reliably detected. Smallest defects like point and line shunts, oxide failures, transistor and diode failures on a PCB surface and in IC´s can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency. Benefits of the Modular Test Bench - Online lock-in measurement with the highest sensitivity - Complete and detailed microscopy analysis - Geometrical resolution up to 1.3 μm per pixel with microscope lenses - Thermal resolution in the microkelvin range - Multi-layer analysis - Automatic scanning of larger samples due to precision mechanics