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Diffusion furnace heating element
waferceramicfor diffusion furnaces

Diffusion furnace heating element - Kanthal - wafer / ceramic / for diffusion furnaces
Diffusion furnace heating element - Kanthal - wafer / ceramic / for diffusion furnaces
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Characteristics

Type
for diffusion furnaces, wafer
Material
ceramic
Applications
for diffusion furnaces
Power

Min.: 0 kW
(0 hp)

Max.: 500 kW
(679.81 hp)

Maximum temperature

Min.: 300 °C
(572 °F)

Max.: 1,350 °C
(2,462 °F)

Description

Fibrothal® diffusion cassettes, available in light and heavy gauges, are designed and oriented horizontally or vertically depending on their intended use. The choice between horizontal and vertical furnaces depends on various factors, including the specific semiconductor manufacturing processes being employed and the goals of the fabrication facility. Selection may be influenced by factors such as wafer size, process requirements, and the overall manufacturing workflow. In practice, both horizontal and vertical furnaces are used in semiconductor manufacturing, and the choice depends on the specific needs and constraints of the manufacturing process. Each orientation has its own set of applications, and manufacturers may use a combination of both types of furnaces in their production facilities. Horizontal cassettes Cassettes are typically for = 200mm wafers. Equipment is highly automated within the customers' fabrication units. Typically, there are four to seven control zones for vertical cassettes.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.