Epoxy adhesive JU-R4S

for plasticssingle-component

Best suited for keeping large components from falling off during double-sided reflow Helps keep components on the board from falling, shifting, or floating during reflow Using a conventional adhesive with solder paste can result in the lifting of components during reflow because the adhesive cures before the solder paste melts. JU-R4S maintains its fluidity while the solder is molten and facilitates setting of the components. Allows solder paste self-alignment at reflow JU-R4S is designed to commence curing after the solder (SAC305) has melted. Therefore, JU-R4S does not hinder self-alignment of components that may occur when the solder has melted. Stable dispense shape and superior electrical reliability after curing Dispensability of JU-R4S was improved by reducing the viscosity while shape retention was also improved by optimizing the TI value. The resultant tall deposits ensure contact and adhesion even for tall components. Nozzle: 19G single　　Dispense pressure: 350kPa　　Dispense time: 60msec Clearance height: 280um　　Syringe temp.: 33℃ Product Performance Table Product Name JU-R4S Product Category Heat Curable SMT Adhesive Composition Epoxy resin State / Color Paste, red Viscosity（Pa.s） 50 Tg（℃） 59.5℃ Shelf life (0-10℃) 6 month