- Industrial machines and equipment
- Welding and Assembly
- Composite material adhesive
- Koki Company Limited
Composite material adhesive JU-110-3single-componentfor printed circuit boardsREACH compliance
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Characteristics
- Type of substrate
- for composite materials
- Number of components
- single-component
- Applications
- for printed circuit boards
- Other characteristics
- REACH compliance
Description
REACH compliant SMT adhesive for dispensing
JU-110-3
Applicable to 1005 chip components
Stable and tall deposits ensure contact even with 1005 chip components
JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits.
Therefore, contact with surface-mounted components of any shape is achieved,
improving reliability of the wave soldering process.
Resistant to heat slump
JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process.
The height of deposits and contact with surface-mounted components are maintained even during heating,
securely holding the components in place.
Compliant to REACH regulation
JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation.
Product Performance Table
Product Name - JU-110-3
Product Category - Heat Curable SMT Adhesive
State / Color - Paste, red
Transition Temperature(℃) - 90
Curing condition - 130ºC, >60sec.
Shelf life (0-10℃) - 6 months
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Heat Curable SMT Adhesive
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.