Camera inspection system ERSASCOPE M + ERSASCOPE M plus

opticaldigitalLED

Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints. High flexibility and speed with hand-held inspection of BGA, µBGA, CSP, FlipChip, CGA and step-through on THT connections. Enables evaluation of heel fills on QFP, SOIC and other gull-wing terminated devices, wetting length and internal wetting on PLCC and J-terminated devices. • Inspection system with two quick-change objectives: • 90° BGA optics (approx. 280 µm gap) • 0° macro zoom inspection optics • Fast inspection of hidden solder joints • Integrated, dimmable LED illumination • N-MOS color camera 5 megapixel, with USB connection • Additional LED fiber light or LED light source with gooseneck and light fan • Ideal for stationary inspection • Ersa ImageDoc v3 inspection software (basic version) included • Dimensions (WxDxH) in mm: 500 x 520 x 400 • Weight in kg: 5 • Design: die-cast aluminum, Z-axis with quick/fine adjustment on fixture for ERSASCOPE inspection optics • Version antistatic (y/n): yes • Connections: Fiber optic light guide with LEMO connector for ERSASCOPE optics and 15 mm connector for light source, additional 1,000 mm gooseneck light guide for light brush, integrated USB 2.0 camera connection cable (USB-A/Mini-USB)