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... production environments. Industries Highest Performing 3D-AXI System: Built Upon a History of Omron’s High-Quality Innovation Solutions. Fully Automated 3D CT X-Ray Inspection incorporating new AI functionality ...
... repeatable CT data.
Product highlights
- Superior inspection envelope for the system size, enabling inspection of diverse samples within a single system.
- Dual-source
Nikon Metrology
... grid array ( BGA), μBGA, CSP and flip chip devices. Mobile inspection system with two quick-change objectives (depending on equipment): 90° BGA optics (approx. 280 µm gap) 0° macro ...
Ersa GmbH
... High-Precision CT Tomography Inspection System. A cutting-edge 3D X-ray inspection solution designed for the PCBA and IGBT fields. Utilizing advanced computer tomography (CT) scanning modes and reconstruction ...
... Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor Lithium ...
... addition to traditional SMD inspection, the compact iX7059 PCB Inspection or iX7059 PCB Inspection XL 3D AXI system also provides high-precision, reliable inspection ...
... 3D/2D manual inspection with a higher resolution for back-end semiconductor applications. Equipped with the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection ...
... devices. • Inspection system with two quick-change objectives: • 90° BGA optics (approx. 280 µm gap) • 0° macro zoom inspection optics • Fast inspection of hidden ...
Kurtz GmbH & Co. KG
... such as power batteries, cylinders, flexible packaging, square shells and laminates, etc. Features of Semicon X Ray Inspection System： 1. The stage can move along the X and Y directions, the detector and the light ...
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