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X-ray inspection system X-8000
electronicsemiconductorautomatic

X-ray inspection system
X-ray inspection system
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Characteristics

Technology
X-ray, electronic, semiconductor
Operational mode
automatic
Type
quality, BGA
Applications
for the electronics industry, for PCB
Other characteristics
fast

Description

X-8000 electronic semiconductor testing equipment can be used to detect integrated circuit chip semiconductors, such as BGA, IGBT, flip-chip and PCBA component welding, high-precision testing in LED, photovoltaic and other industries; widely used in industrial manufacturing fields,such as auto parts, foundry Testing, pressure vessel and pipe welding quality testing and new material analysis; can detect defects in varioustypes of batteries, such as power batteries, cylinders, flexible packaging, square shells and laminates, etc. Features of Semicon X Ray Inspection System: 1. The stage can move along the X and Y directions, the detector and the light pipe can move along the Z direction, and the speed can be divided into slow, medium and fast. 2. The effective detection range is larger, and the magnification and detection efficiency of the product are improved. 3. It is easy to identify the defects of the product's side inclination, and realize the detection without dead angle. 4. Adopt the world's top Japanese Hamamatsu X-ray source. 5. It is easy to identify the bending and breaking of gold wires in semiconductor packaging. 6. Editable detection program to realize CNC automatic detection. 7. It is suitable for mass detection, improves detection efficiency, and automatically judges NG products. 8. The super-large automatic navigation window, the stage can be moved to the pointed position by clicking the mouse. 9. The operation is very convenient, and the defect of the item can be found quickly, which improves the detection efficiency. 10. High safety, with EU CE Certificate, International Quality Management System ISO, and AERB Certificate for X-ray.

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