X-ray inspection system TR7600HP

FPAcameracomputed tomography

Introduction
The TR7600HP is a high-power 3D CT AXI system engineered for production-level inspection of power modules, including IGBTs, MOSFETs and SiC inverters. Advanced 3D AXI algorithms remove heatsink shadows and reduce noise to provide clear volumetric images. Integrated AI inspection tools (AI-Void Detection and AI-driven programming) enable robust, repeatable defect detection and faster program setup. The system is Smart Factory Ready with standard MES connectivity for inline production environments.

Features

• High-power 3D CT AXI optimized for IGBT, power module and inverter inspection
• AI-powered inspection algorithms, AI-Void Detection and AI-driven programming
• Flexible multi-resolution platform for production: 7–30 μm
• Inline fine-tuning without interrupting production
• Supports boards up to 950 x 530 mm and up to 12 kg
• Smart Factory Ready with easy MES connectivity (SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852)
• Ease of maintenance and radiation-safe design

Imaging System (AXI)
Camera: Flat panel detector
X-ray source: 40–180 kV
Imaging resolution: 7 μm – 30 μm
Inspection methods: 2D, 2.5D, 3D slicing, planar CT (optional)

Motion Table & Control
X-axis: High-precision ballscrew + AC-servo controller
Y-axis: High-precision dual-driven ballscrew + AC-servo controller
Z-axis: High-precision ballscrew + AC-servo controller
X-Y axis resolution: N/A

Board Handling
Max PCB size: 950 x 530 mm
PCB thickness: 0.4–7 mm
Max PCB weight: 12 kg
Top clearance: @30 μm: 70 mm
@25 μm: 70 mm
@20 μm: 70 mm
@15 μm: 60 mm
@10 μm: 30 mm
@7 μm: 15 mm
Bottom clearance: 70 mm
Edge clearance: 3 mm or 5 mm
Conveyor height: 880–920 mm (optional 940–965 mm)

Inspection Functions - Capabilities

• BGAs
• Backdrill
• Barrel fill
• Capacitors
• Resistors
• Chips
• Components under RF shields
• WLCSP
• DIMM connectors
• Flip-chips
• Ground pads
• Gullwing
• Heat sinks
• J-leads
• LED chips
• LGAs
• RNET
• SiP
• SMT connectors
• SOIC, SOT
• Thermal pad
• QFNs, QFP and THTs
• IGBT

Inspection Functions - Defects
Detectable defects: missing, misalignment, tombstone, billboard, tantalum polarity, rotation, insufficient/excess solder, bridging, open, solder ball, non-wetting, void, lifted lead

Dimensions
WxDxH: 1730 x 2300 x 1980 mm (signal tower not included; tower height: 519 mm)
Weight: 5500 kg
Power: 200–240 VAC, single phase, 50/60 Hz, 4 kVA

Technical specifications

• Model: TR7600HP
• Imaging camera: Flat panel detector
• X-ray source power range: 40–180 kV
• Imaging resolution: 7–30 μm
• Supported inspection methods: 2D, 2.5D, 3D slicing, planar CT (optional)
• Motion control: High-precision ballscrew + AC-servo; Y-axis dual-driven ballscrew + AC-servo
• Max PCB size: 950 x 530 mm
• PCB thickness range: 0.4–7 mm
• Max PCB weight: 12 kg
• Top clearance by resolution: 30/25/20 μm = 70 mm; 15 μm = 60 mm; 10 μm = 30 mm; 7 μm = 15 mm
• Bottom clearance: 70 mm
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880–920 mm (optional 940–965 mm)
• Platform: Flexible multi-resolution production platform (7–30 μm)
• AI features: AI-powered inspection algorithms, AI-Void Detection, AI-driven programming
• Factory integration: Smart Factory Ready with MES connectivity (SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852)
• Dimensions (WxDxH): 1730 x 2300 x 1980 mm
• Machine weight: 5500 kg
• Power: 200–240 VAC, single phase, 50/60 Hz, 4 kVA