X-ray inspection system TR7600F2D Plus

FPAcamera2D

Introduction
The 2.5D inline AXI TR7600F2D Plus is built on a new mechanical platform to achieve faster cycle times, delivering approximately 10% performance improvement over the previous model. With a high imaging resolution down to 5 µm, the system provides full-coverage inspection optimized for consumer and mobile electronics manufacturing.

Features

• Next-generation mechanical design for faster cycle time
• Flexible multi-resolution and multi-power capability in one configuration
• New motion controller for real-time measurements and simplified maintenance
• Improved 2D camera for easier adjustments and reduced calibration
• Large board inspection capacity up to 900 mm × 520 mm
• Smart factory ready with MES connectivity

Inspection Capabilities (summary)

• BGAs
• Capacitors
• Chips
• WLCSP
• DIMM connectors
• Flip-chips
• Ground pads
• Gullwing
• Heat sinks
• J-leads
• LED chips
• LGAs
• Paladin connector
• Resistors
• RNET
• SiP
• SMT connectors
• SOIC
• SOT
• Thermal pads
• QFNs
• QFP
• THTs

Detectable Defects (summary)

• Missing
• Misalignment
• Tombstone
• Billboard
• Tantalum polarity
• Rotation
• Insufficient or excess solder
• Bridging
• Open
• Solder ball
• Void

Technical specifications

• Imaging system: Camera = Flat panel detector
• X-ray source: 60–130 kV
• Imaging resolution: 5 µm – 30 µm (high resolution: 5 µm)
• Inspection method: 2D, 2.5D
• Motion table & control: X/Y/Z axis = high-precision ballscrew + AC-servo controller
• Max PCB size: 900 × 520 mm
• PCB thickness: 0.5 – 7 mm
• Max PCB weight: 12 kg
• Top clearance: @15/20/25/30 µm: 50 mm; @10 µm: 30 mm; @5 µm: 10 mm
• Bottom clearance: 50 mm
• Edge clearance: 3 mm or 5 mm
• Conveyor height: 880 – 920 mm (SMEMA compatible)
• Inspection capabilities: BGAs, capacitors, chips, WLCSP, DIMM connectors, flip-chips, ground pads, gullwing, heat sinks, J-leads, LED chips, LGAs, Paladin connector, resistors, RNET, SiP, SMT connectors, SOIC, SOT, thermal pads, QFNs, QFP, THTs
• Detectable defects: Missing, misalignment, tombstone, billboard, tantalum polarity, rotation, insufficient/excess solder, bridging, open, solder ball, void
• Dimensions (W × D × H): 1537 × 2160 × 1800 mm (signal tower not included; signal tower height: 519.5 mm)
• Weight: 3150 kg
• Power requirement: 200–240 VAC, single phase, 50/60 Hz, 4 kVA