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X-ray inspection system TR7600F2D QL
focal plane arraycamera2D

X-ray inspection system - TR7600F2D QL - TRI Test Research Europe GmbH - focal plane array / camera / 2D
X-ray inspection system - TR7600F2D QL - TRI Test Research Europe GmbH - focal plane array / camera / 2D
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Characteristics

Technology
camera, X-ray, 2D, focal plane array
Operational mode
automated
Type
for defect detection, surface defect, measurement, BGA, soldering
Applications
for the automotive industry, for the electronics industry, for PCB
Configuration
in-line
Other characteristics
high-resolution, computer-controlled, non-contact

Description

Introduction
The TR7600F2D QL is an automated 2D AXI (Automated X‑ray Inspection) system designed for inline inspection of large PCBs up to 2100 x 510 mm. It supports multi-resolution imaging from 5 to 30 µm and integrates a dedicated 2D camera for automotive tasks such as barcode reading and fiducial detection.

Features
  • Large board inspection: up to 2100 x 510 mm
  • Flexible multi-resolution: 5 – 30 µm
  • Inline fine-tuning without production interruption
  • AI-powered algorithms for defect recognition
  • 2D camera for barcode reading, fiducials and bare-board marking (automotive)
  • Smart factory ready: MES connectivity
  • Typical applications: server boards, LED boards, automotive ECU inspection


Imaging System (AXI)
Camera: Flat panel detector
X‑ray source voltage: 60 – 130 kV
Imaging resolution: 5 µm – 25 µm (AXI)
Inspection method: 2D

Motion Table & Control
X/Y/Z control: High‑precision ballscrew with AC‑servo controllers
X‑Y axis resolution: specified per configuration

Board Handling
Max PCB size: 2100 x 510 mm
PCB thickness: 0.6 – 7 mm
Max PCB weight: 12 kg
Top clearance by resolution: 50 mm (@20/25 µm); 40 mm (@15 µm); 25 mm (@10 µm); 3 mm (@5 µm)
Bottom clearance: 70 mm
Edge clearance: 3 mm or 5 mm
Conveyor height: 880 – 920 mm (optional 940 – 965 mm)
SMEMA compatible

Inspection Capabilities
  • Components inspected: BGAs, capacitors, chips, WLCSP, DIMM connectors, flip‑chips, ground pads, gullwing, heat sinks, J‑leads, LED chips, LGAs, connectors, resistors, RNET, SiP, SMT connectors, SOIC, SOT, thermal pads, QFNs, QFP, THTs
  • Detectable defects: missing, misalignment, tombstone, billboard, polarity, rotation, insufficient/excess solder, bridging, solder balls, voids


Dimensions & Power
WxDxH: 3600 x 2000 x 1940 mm (excluding signal tower; tower height: 520 mm)
Weight: 5800 kg
Power: 200 – 240 VLL, three‑phase, 50/60 Hz, 7.0 kVA

Applications
  • Server board inspection
  • LED board inspection
  • Automotive ECU and automotive‑related inspections (barcode reading, fiducial detection)


Technical specifications
  • Model: TR7600F2D QL
  • Max PCB size: 2100 x 510 mm
  • PCB thickness: 0.6 – 7 mm
  • Max PCB weight: 12 kg
  • Imaging resolution (AXI): 5 µm – 25 µm
  • X‑ray voltage: 60 – 130 kV
  • Inspection method: 2D
  • Camera: Flat panel detector
  • Motion control: high‑precision ballscrew + AC‑servo (X/Y/Z)
  • Top clearance by resolution: 50 mm (@20/25 µm); 40 mm (@15 µm); 25 mm (@10 µm); 3 mm (@5 µm)
  • Bottom clearance: 70 mm
  • Edge clearance: 3 mm or 5 mm
  • Conveyor height: 880 – 920 mm (optional 940 – 965 mm)
  • SMEMA compatible
  • WxDxH: 3600 x 2000 x 1940 mm (without signal tower)
  • Weight: 5800 kg
  • Power: 200 – 240 VLL, three‑phase, 50/60 Hz, 7.0 kVA

Exhibitions

Meet this supplier at the following exhibition(s):

ELECTRONICA 2026
ELECTRONICA 2026

10-13 Nov 2026 Munich (Germany) Hall A4 - Stand 638

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.